Processor manufacturers today use optical lithography, which uses light to transfer the semiconductor pattern. That process can make it difficult for engineers to shrink the pattern, a key part of boosting chip performance.

IBM is looking for the DNA to act as scaffolds, or miniature circuit boards, for the highly precise assembly of chip components, like nanotubes, nanowires and nanoparticles. Using this technique, manufacturers should be able to build "significantly smaller" chips than has been possible with current semiconductor fabrication technology, according to IBM.