That's according to , who discovered two patent applications detailing the headphones filed by Apple last year and published on 12 April.

In the , titled "Ultrasonically welded structures and methods for making the same", Apple describes headsets that include non-cable components such as jack, headphones, microphones and cables that interconnect the non-cable components as "abrupt and aesthetically displeasing."

Therefore, Apple wants to create "headsets with seamless non-cable components and cable components that seamlessly integrate with the non-cable components."

Apple's planned headphones will "appear to have been constructed as a seamless unibody structure."

Alongside the aforementioned patent application, Apple also filed for .